COIM Brazil launched new sticker on Fispal 2015

The COIM-Chimica Organica Industriale Milanese, great specialty chemicals manufacturer located in Vinhedo, São Paulo State, participated in the 2015 Edition of the Fispal technology. The fair is known as the largest and most comprehensive in the industry, Packaging and logistics processes for the food and Beverage Industries of Latin America and happened between 23 and 26 June in São Paulo-SP.
At the time, the company launched a new line without Solvent adhesive, in addition to exposing its partnership with NDC Technologies, American brand responsible for developing the heavy reader, which checks the actual measurement of the adhesive applied online (g/m2) in the Act of lamination, which can be fixed during the process, in order to avoid losses and damage. At the Italian multinational was made a demonstration of the equipment.
This is the third participation of COIM Brazil, in a big fair in the first half of 2015. According to the President the COIM Brazil, José Paulo Victorio, Fispal technology is a very significant event in the industry. "In a fair of this ratio is possible to spread with our current and future partners, the new processes and technologies applied in our industry. Interact with professionals from companies that produce and supply packaging directly is, without doubt, very assertive, "he says.
During the event, the Brazil COIM launched SF 5419/CA 5516-a new row without adhesive Solvent the company. According to Carlos Gandolphi, Development Manager, it is a sticker suitable for lamination of PE/PE films, in which the tear resistance is fundamental. "The new product features large force of final lamination, cure for cut with short time (from 6 to 12:0), it's not fog maker, has low viscosity and shows no ink bleeding", explains.