Henkel launches hotmelt with lower application temperature of the market

Compared to conventional hotmelts, the Technomelt Supra 100 Cool reduces by up to 50% power consumption
Global leader in adhesives, sealants and surface treatment, Henkel offers the new hotmelt adhesive Technomelt Supra 100 Cool for the packaging industry.
With application temperature of 100° C the Cool Technomelt Supra 100 is the hotmelt with lower application temperature of its class on the market. This innovation of the Henkel launches extreme efficiency in packaging production, while also promotes sustainability in operations for customers.
Production tests conducted by manufacturers of consumer goods in Europe have shown that the low temperature of the Technomelt Supra 100 Cool reduces by up to 50% of energy consumption compared to conventional hotmelts.
In addition to the low application temperature of 100° C and high adhesive strength Technomelt Supra 100 Cool, is also characterized by appropriateness in the process of sealing, packaging and Assembly of closing the tray. As well as all the products of line of the Technomelt Supra Technomelt, Cool 100 is suitable for application in the food industry.
Wide window of application allows hot and cold packs
An additional Cool Technomelt Supra 100 offered by is his great heat resistance and flexibility at low temperatures, which enables its use for both hot and cold applications.
Application of low temperature also provides faster startup of the applicator and the wear of machine components is reduced significantly. In this way, the Cool Technomelt Supra 100 saves part of the operation of the equipment and increases the effectiveness of the production.